Transmission Electron Microscopy (TEM)
Electron Probe Micro Analysis (EPMA)
Variable Pressure Scanning Electron Microscopy (VP-SEM)
Field Emission Scanning Electron Microscopy (FESEM)
Dual Beam – Focused Ion Beam Microscopy (SEM-FIB)
Nuclear Magnetic Resonance (NMR) Spectroscopy
Solution NMR:
Solid-State NMR:
- Varian VNMRS-500 NMR Spectrometer with CPMAS Solid-State NMR Probe
Electron Paramagnetic Resonance (EPR):
X-Ray Photoelectron Spectroscopy (XPS)
Dynamic Mechanical Analysis (DMA)
Differential Scanning Calorimetry (DSC)
Thermogravimetric Analysis (TGA)
Organic and Printed Electronics
Atomic Force Microscopy (AFM)
- Bruker Dimension Icon AFM with Fastscan, optical, thermal, and scanning electrochemical analysis capabilities
- Digital Instruments Multimode Atomic Force Microscope with IIIa controller
Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS)
Spectroscopic Ellipsometry (SE)
Scanning Near-field Optical Microscopy (SNOM)
X-ray Characterization Laboratory
- Bruker AXS DUO Detector System
- Bruker AXS Smart APEX CCD Area Detector System
- Rigaku SmartLab XRD with position sensitive and point detector, in plane arm for powder and thin films
- SAXSess (small angle x-ray diffractometer)
- Rigaku x-ray fluorescence (WDS)spectrometer for elemental analysis of solids
Photovoltaic Characterization Facility
- Dektak 6M stylus profilometer
- Perkin Elmer Lambda-1050 UV/Vis/NIR spectrophotometer
- Solar cell I-V characterization system
- Solar cell quantum efficiency / spectral response system
- Zygo NewView 7300 optical 3D profilometer
- Angstrom Instruments E-Beam / Thermal Deposition System
Molecular Materials Analysis
- Nicolet 6700 IR Spectrometer with Ge GATR, Diamond ATR, and Seagull reflectance accessory for in-situ and ex-situ analysis of powders and films
- Wyatt Mobius Dynamic Light Scattering and Zeta Potential for analysis of molecules and colloids in solution
- Rame-hart contact-angle goniometer for surface energy measurements
Rapid Materials Prototyping Facility
- Direct-write laser lithography and mask writing tool (0.5 micron resolution) for rapid pattern generation
- Mask aligner with backside alignment capability
- Multiple materials deposition systems (e-beam, thermal, atomic layer deposition, sputter, plasma-enhanced CVD)
- Variable angle spectroscopic ellipsometer for rapid film properties measurement